JPH0346992B2 - - Google Patents
Info
- Publication number
- JPH0346992B2 JPH0346992B2 JP30408489A JP30408489A JPH0346992B2 JP H0346992 B2 JPH0346992 B2 JP H0346992B2 JP 30408489 A JP30408489 A JP 30408489A JP 30408489 A JP30408489 A JP 30408489A JP H0346992 B2 JPH0346992 B2 JP H0346992B2
- Authority
- JP
- Japan
- Prior art keywords
- flexible
- bending
- circuit pattern
- electrolytic plating
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005452 bending Methods 0.000 claims description 31
- 238000009713 electroplating Methods 0.000 claims description 26
- 230000007704 transition Effects 0.000 claims description 18
- 238000007747 plating Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 12
- 239000000126 substance Substances 0.000 description 10
- 239000011888 foil Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30408489A JPH0368187A (ja) | 1989-11-22 | 1989-11-22 | フレキシブル回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30408489A JPH0368187A (ja) | 1989-11-22 | 1989-11-22 | フレキシブル回路基板 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59132253A Division JPS6112094A (ja) | 1984-06-27 | 1984-06-27 | フレキシブル回路基板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0368187A JPH0368187A (ja) | 1991-03-25 |
| JPH0346992B2 true JPH0346992B2 (en]) | 1991-07-17 |
Family
ID=17928837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30408489A Granted JPH0368187A (ja) | 1989-11-22 | 1989-11-22 | フレキシブル回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0368187A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4162583B2 (ja) * | 2003-12-19 | 2008-10-08 | 三井金属鉱業株式会社 | プリント配線板および半導体装置 |
| EP2071907B1 (en) | 2006-09-21 | 2014-01-22 | Daisho Denshi Co. Ltd. | Flex-rigid printed circuit board, and method for manufacturing the flex-rigid printed circuit board |
-
1989
- 1989-11-22 JP JP30408489A patent/JPH0368187A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0368187A (ja) | 1991-03-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |